DoD announces a $10M agreement with Six Sigma to boost microelectronics for military use. Learn more about this vital project.
Identify nickel hydroxide corrosion residues on ceramic packages. Ensure reliability in military & space microelectronics. Contact us today!
SIX SIGMA's SolderQuik® tech enhances FPGA microcircuits on CFEsat. Learn more about our military & aerospace solutions.
Address tin whisker risks in microelectronics with hot solder dip. Contact us for expert solutions in high-reliability applications.
Review the Actel CCGA Board Level Testing Report. Ensure reliability for military & space applications. Contact us for details!
Learn how BGA reballing ensures reliability in military and aerospace systems by converting lead-free COTS components to high-lead solder for mission-critical use.
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.