News

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
May 24, 2023
DoD announces a $10M agreement with Six Sigma to boost microelectronics for military use. Learn more about this vital project.
Nickel Hydroxide Corrosion Residues
By No Author October 4, 2015
Identify nickel hydroxide corrosion residues on ceramic packages. Ensure reliability in military & space microelectronics. Contact us today!
March 9, 2007
SIX SIGMA's SolderQuik® tech enhances FPGA microcircuits on CFEsat. Learn more about our military & aerospace solutions.
Six Sigma’s Robotic Hot Solder Dip system
October 4, 2006
Address tin whisker risks in microelectronics with hot solder dip. Contact us for expert solutions in high-reliability applications.

Recent Posts

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.