Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages

No Author • October 4, 2015
Nickel Hydroxide Corrosion Residues

This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture.


Read the PDF

Recent Posts

Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics event poster with speaker photo, Earth backdrop, and May 5–7, 2026 details
April 27, 2026
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Advertisement for Six Sigma Microelectronics featuring a satellite orbiting Earth, service list, and booth information.
April 10, 2026
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.