Six Sigma Microelectronics to Exhibit and Present at CMSE 2026

April 10, 2026

The body content of your post goes here. To edit this text, click on it and delete this default text and start typing your own or paste your own from a different source.

A flyer for Six Sigma Microelectronics featuring a satellite orbiting Earth and event details including booth location.

Six Sigma Microelectronics is pleased to announce our participation in the Components for Military & Space Electronics (CMSE) Conference & Exhibition taking place April 29–30, 2026 at the Renaissance Los Angeles Airport Hotel.


The annual conference brings together engineers, component specialists, and industry leaders focused on the reliability and performance of electronic components used in aerospace, defense, and space applications. The event features technical presentations, tutorials, and an exhibition showcasing leading suppliers supporting mission-critical electronics.

Our team will be exhibiting at Booth B15 during the conference exhibit sessions. We invite attendees to stop by to learn more about our specialized services supporting high-reliability microelectronics, including:



  • Column attach 
  • Ball attach and BGA reballing 
  • Hot solder dip (HSD) 
  • Failure analysis for mission-critical applications 


Our engineers will be available to discuss how Six Sigma Microelectronics helps transform commercial microelectronics into flight-ready hardware for aerospace and defense programs.

We are also proud to share that Minerva Cruz, Process Engineering and Reliability Manager at Six Sigma Microelectronics, will present during the Technical Talks session.

This presentation will explore best practices and reliability considerations when reballing BGA devices for high-reliability environments, including aerospace, defense, and space systems where performance and long-term reliability are essential.

CMSE provides an excellent opportunity to connect with the engineers and organizations shaping the future of high-reliability electronics. We look forward to engaging with industry peers, sharing technical insights, and discussing how Six Sigma Microelectronics supports mission-critical applications across the aerospace and defense supply chain.


If you plan to attend CMSE 2026, be sure to visit us at Booth B15. We look forward to seeing you there.

< Older Post

Recent Posts

DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma

May 24, 2023
As part of the nation’s effort to sustain the microelectronics manufacturing capability necessary for national and economic security, and in support of Executive Order 14017, America’s Supply Chains, the Department of Defense recently entered a $10 million agreement with Six Sigma utilizing Defense Production Act (DPA) Title III authorities. Six Sigma will increase the capacity of both its copper solder column manufacturing and column attach processes to enable the production of high-reliability Column Grid Array components (such as Field Programmable Gate Arrays and Application Specific Integrated Circuits) for military and aerospace applications. The project will run 51-months and be performed at its facility in Milpitas, California. “This investment ensures critical DoD military and space programs operating in extreme thermal and vibration environments are available to meet the needs of American strategic interests,” said Dr. Taylor-Kale, ASD (IBP). “It exemplifies the Department’s commitment to ensuring the resilience and integrity of our nation’s critical supply chains.” About the Department of Defense’s Office of the Assistant Secretary of Defense for Industrial Base Policy Industrial Base Policy is the principal advisor to the Under Secretary of Defense for Acquisition and Sustainment (USD(A&S)) for developing Department of Defense policies for the maintenance of the United States defense industrial base (DIB), executing small business programs and policy, and conduction geo-economic analysis and assessments. The office also provides the USD(A&S) with recommendations on budget matters related to the DIB, anticipates and closes gaps in manufacturing capabilities for defense systems, and assesses impacts related to mergers, acquisition, and divestitures. IBP monitors and assesses the impact of foreign investments in the United States and executes authorities under sections 2501 and 2505 U.S.C. Title 10. See DoD Press Release
Nickel Hydroxide Corrosion Residues

Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages

By No Author • October 4, 2015
This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture. Read the PDF

SIX SIGMA Solder Column Technology used in CFEsat

March 9, 2007
FOR IMMEDIATE RELEASE Contact: Dale Albright Sales and Business Development Milpitas, CA – May 9, 2007 – SIX SIGMA is pleased to announce that it’s SolderQuik® column grid array technology has been used to ruggedize FPGA microcircuits on-board the Cibola Flight Experiment Satellite (CFEsat). The satellite, which was launched on March 8, 2007, is equipped with an experimental supercomputer that utilizes columnized FPGAs commonly known as Column Grid Array (CGA). The same SIX SIGMA SolderQuik® technology is also an integral part of numerous other military and aerospace programs. SIX SIGMA is proud to welcome CFEsat into the family of military and aerospace programs that currently use SolderQuik® column grid array technology. For information about column grid array technology, contact SIX SIGMA at 408-956-0100 x1 or visit the web site at http://www.sixsigmaservices.com/columnattach.asp .