News

Six Sigma’s Robotic Hot Solder Dip system
October 4, 2006
Address tin whisker risks in microelectronics with hot solder dip. Contact us for expert solutions in high-reliability applications.
Ceramic Column Grid Array (CCGA)
October 1, 2006
Review the Actel CCGA Board Level Testing Report. Ensure reliability for military & space applications. Contact us for details!

Recent Posts

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.