The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. Read the PDF .
Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high performance FPGA devices at a reliability level that can meet space satellite requirements.
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.