Learn how converting Ball Grid Array (BGA) to Column Grid Array (CGA) improves reliability in military and space electronics by reducing CTE mismatch and stress.
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.