News

Converting Ball Grid Array to Column Grid Array Poster
November 1, 2005
Learn how converting Ball Grid Array (BGA) to Column Grid Array (CGA) improves reliability in military and space electronics by reducing CTE mismatch and stress.

Recent Posts

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.