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As part of the nation’s effort to sustain the microelectronics manufacturing capability necessary for national and economic security, and in support of Executive Order 14017, America’s Supply Chains, the Department of Defense recently entered a $10 million agreement with Six Sigma utilizing Defense Production Act (DPA) Title III authorities. Six Sigma will increase the capacity of both its copper solder column manufacturing and column attach processes to enable the production of high-reliability Column Grid Array components (such as Field Programmable Gate Arrays and Application Specific Integrated Circuits) for military and aerospace applications. The project will run 51-months and be performed at its facility in Milpitas, California. “This investment ensures critical DoD military and space programs operating in extreme thermal and vibration environments are available to meet the needs of American strategic interests,” said Dr. Taylor-Kale, ASD (IBP). “It exemplifies the Department’s commitment to ensuring the resilience and integrity of our nation’s critical supply chains.” About the Department of Defense’s Office of the Assistant Secretary of Defense for Industrial Base Policy Industrial Base Policy is the principal advisor to the Under Secretary of Defense for Acquisition and Sustainment (USD(A&S)) for developing Department of Defense policies for the maintenance of the United States defense industrial base (DIB), executing small business programs and policy, and conduction geo-economic analysis and assessments. The office also provides the USD(A&S) with recommendations on budget matters related to the DIB, anticipates and closes gaps in manufacturing capabilities for defense systems, and assesses impacts related to mergers, acquisition, and divestitures. IBP monitors and assesses the impact of foreign investments in the United States and executes authorities under sections 2501 and 2505 U.S.C. Title 10. See DoD Press Release
This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture. Read the PDF
FOR IMMEDIATE RELEASE Contact: Dale Albright Sales and Business Development Milpitas, CA – May 9, 2007 – SIX SIGMA is pleased to announce that it’s SolderQuik® column grid array technology has been used to ruggedize FPGA microcircuits on-board the Cibola Flight Experiment Satellite (CFEsat). The satellite, which was launched on March 8, 2007, is equipped with an experimental supercomputer that utilizes columnized FPGAs commonly known as Column Grid Array (CGA). The same SIX SIGMA SolderQuik® technology is also an integral part of numerous other military and aerospace programs. SIX SIGMA is proud to welcome CFEsat into the family of military and aerospace programs that currently use SolderQuik® column grid array technology. For information about column grid array technology, contact SIX SIGMA at 408-956-0100 x1 or visit the web site at http://www.sixsigmaservices.com/columnattach.asp .