Learn how BGA reballing ensures reliability in military and aerospace systems by converting lead-free COTS components to high-lead solder for mission-critical use.
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.