This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture. Read the PDF
The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. Read the PDF .
Learn how BGA reballing ensures reliability in military and aerospace systems by converting lead-free COTS components to high-lead solder for mission-critical use.
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.