Hot Solder Dip and Minimizing Thermal Gradients

October 4, 2006
Six Sigma’s Robotic Hot Solder Dip system

The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes.


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