Actel CCGA Board Level Testing Report

October 1, 2006
Ceramic Column Grid Array (CCGA)

Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high performance FPGA devices at a reliability level that can meet space satellite requirements.

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