sixsigmamicro

Six Sigma Microelectronics to Exhibit and Present at CMSE 2026

Fri, 10 Apr 2026 13:50:38 GMT

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Visit Us at Booth B15

Our team will be exhibiting at Booth B15 during the conference exhibit sessions. We invite attendees to stop by to learn more about our specialized services supporting high-reliability microelectronics, including:

Column attach
Ball attach and BGA reballing
Hot solder dip (HSD)
Failure analysis for mission-critical applications

Our engineers will be available to discuss how Six Sigma Microelectronics helps transform commercial microelectronics into flight-ready hardware for aerospace and defense programs.

We are also proud to share that Minerva Cruz, Process Engineering and Reliability Manager at Six Sigma Microelectronics, will present during the Technical Talks session.

Technical Presentation

Six Sigma Microelectronics is pleased to announce our participation in the Components for Military & Space Electronics (CMSE) Conference & Exhibition taking place April 28–30, 2026, at the Renaissance Los Angeles Airport Hotel.

The annual conference brings together engineers, component specialists, and industry leaders focused on the reliability and performance of electronic components used in aerospace, defense, and space applications. The event features technical presentations, tutorials, and an exhibition showcasing leading suppliers supporting mission-critical electronics.

Presentation Title:
“BGA Reballing for Mission-Critical Applications”

This presentation will explore best practices and reliability considerations when reballing BGA devices for high-reliability environments, including aerospace, defense, and space systems where performance and long-term reliability are essential.

Let’s Connect at CMSE

CMSE provides an excellent opportunity to connect with the engineers and organizations shaping the future of high-reliability electronics. We look forward to engaging with industry peers, sharing technical insights, and discussing how Six Sigma Microelectronics supports mission-critical applications across the aerospace and defense supply chain.

If you plan to attend CMSE 2026, be sure to visit us at Booth B15 . We look forward to seeing you there.

DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma

Wed, 24 May 2023 04:46:51 GMT

As part of the nation’s effort to sustain the microelectronics manufacturing capability necessary for national and economic security, and in support of Executive Order 14017, America’s Supply Chains, the Department of Defense recently entered a $10 million agreement with Six Sigma utilizing Defense Production Act (DPA) Title III authorities.

Six Sigma will increase the capacity of both its copper solder column manufacturing and column attach processes to enable the production of high-reliability Column Grid Array components (such as Field Programmable Gate Arrays and Application Specific Integrated Circuits) for military and aerospace applications. The project will run 51-months and be performed at its facility in Milpitas, California.

“This investment ensures critical DoD military and space programs operating in extreme thermal and vibration environments are available to meet the needs of American strategic interests,” said Dr. Taylor-Kale, ASD (IBP). “It exemplifies the Department’s commitment to ensuring the resilience and integrity of our nation’s critical supply chains.”

About the Department of Defense’s Office of the Assistant Secretary of Defense for Industrial Base Policy Industrial Base Policy is the principal advisor to the Under Secretary of Defense for Acquisition and Sustainment (USD(A&S)) for developing Department of Defense policies for the maintenance of the United States defense industrial base (DIB), executing small business programs and policy, and conduction geo-economic analysis and assessments. The office also provides the USD(A&S) with recommendations on budget matters related to the DIB, anticipates and closes gaps in manufacturing capabilities for defense systems, and assesses impacts related to mergers, acquisition, and divestitures. IBP monitors and assesses the impact of foreign investments in the United States and executes authorities under sections 2501 and 2505 U.S.C. Title 10.

See DoD Press Release

Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages

Sun, 04 Oct 2015 04:42:53 GMT

This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture.

Read the PDF

SIX SIGMA Solder Column Technology used in CFEsat

Fri, 09 Mar 2007 04:37:52 GMT

FOR IMMEDIATE RELEASE

Contact:

Dale Albright

Sales and Business Development

Milpitas, CA – May 9, 2007 – SIX SIGMA is pleased to announce that it’s SolderQuik® column grid array technology has been used to ruggedize FPGA microcircuits on-board the Cibola Flight Experiment Satellite (CFEsat). The satellite, which was launched on March 8, 2007, is equipped with an experimental supercomputer that utilizes columnized FPGAs commonly known as Column Grid Array (CGA). The same SIX SIGMA SolderQuik® technology is also an integral part of numerous other military and aerospace programs.

SIX SIGMA is proud to welcome CFEsat into the family of military and aerospace programs that currently use SolderQuik® column grid array technology. For information about column grid array technology, contact SIX SIGMA at 408-956-0100 x1 or visit the web site at http://www.sixsigmaservices.com/columnattach.asp .

Hot Solder Dip and Minimizing Thermal Gradients

Wed, 04 Oct 2006 04:33:47 GMT

The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes.

Read the PDF .

Actel CCGA Board Level Testing Report

Sun, 01 Oct 2006 04:27:58 GMT

Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high performance FPGA devices at a reliability level that can meet space satellite requirements.

Read External PDF Report

BGA Reballing for Military & Aerospace Applications

Wed, 01 Mar 2006 04:21:21 GMT

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Introduction

Commercial market rapidly converting to lead-free
Military and aerospace community not ready for lead-free
Reduced availability of tin-lead Ball Grid Array (BGA) components
Conversions (carefully performed) essential to ensuring availability and reliability of components for rugged application

The Problem

Diminishing supply of tin-lead BGA components
Reliability concerns with lead-free
High thermal cycle environments
Shock and vibration
Tin whiskers?
Reballing requires controlled processes to eliminate reliability risks

Reball Process Flow

Automated sphere removal in FlexLine ^® robotic solder dip system
Solder spheres and intermetallics are dissolved and flushed away by passing the component across a low temperature solder wave
Forced-air preheat / cool down to minimize thermal shock
Flux, preheat, solder, cool down, and rinse are fully programmable and repeatable
Controlled, gentle, multi-unit process

Deball

Low-Volume Solution

Patented SolderQuik TM preform
Total pattern flexibility
Fast turn around (1-3 days)
Moderate piece-part cost

Sphere Placement

High-Volume Solution

Automated handling
Custom tooling ($)
Tooling lead time (3-6 weeks)
Low piece-part cost

Reflow

Forced-convection reflow
Controlled process
Low component temperature maintained
Component thermal gradient minimized

Process Monitors and Controls

Temperature & humidity controlled environment
Conductive flooring - ESD safe work areas
Solder analysis at carefully timed intervals
100% acoustic microscopy screening available
Ball shear testing
Fully equipped reliability and failure analysis lab

Conclusion

Commercial components may not always be capable of meeting the environmental requirements of military and aerospace industry
BGA reballing, with proper controls, resolves:
Component availability
Mixed solder issues
Reliability risks with lead-free

The Reballing Solution

Component level modifications (including BGA reballing) are essential to the future of military and aerospace industry
Reballing allows Commercial-off-the-Shelf (COTS) components to be used in high-reliability applications without the concerns associated with mixing of lead-free and tin-lead solders
Reballing with high-lead solder spheres can provide even better reliability than standard tin-lead alloys
High-lead spheres are more ductile and provide a higher standoff, which can significantly improve solder joint reliability

Contact Us

SIX SIGMA

905 Montague Expressway Milpitas, CA 95035

Email: sales@solderquik.com

Phone: (408) 956 0100

Fax: (408) 956 0199

SolderQuik ^TM is a patented technology licensed exclusively to SIX SIGMA - Winslow Automation, Inc. FlexLine ^® is a registered trademark of Winslow Automation, Inc.

Converting Ball Grid Array to Column Grid Array

Tue, 01 Nov 2005 04:17:12 GMT

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Introduction

The availability of Military-grade electronics is declining
Ball Grid Array (BGA) is rapidly becoming the package style of choice in commercial electronics
For Military and Space environments, BGA packaging is a reliability compromise (BGAs lack compliant leads)
Modifications and ruggedization of packaging is essential for ensuring reliability of military electronics ⁴

The Problem

Solder balls are less compliant than leads
Stress is induced by:
Coefficient of Thermal Expansion (CTE) mismatch (temperature cycle)
Thermal mismatch (power cycle)
Mechanical (warp, vibration, etc)
Stress increases with:
Distance from neutral point (larger packages)
Lower standoff height

Column Grid Array (CGA) is a flexible interconnect replacement for rigid solder balls
Higher standoff and compliance in the column alleviates CTE and thermal mismatch between the board and the component

BGA vs. CGA

ΔT ₁ = Temperature Change of Board
ΔT ₂ = Temperature Change of Component
α ₁ = CTE of the Board
α ₂ = CTE of the Component
S = Distance from Neutral Point (DNP)
E = Modulus of Elasticity of Ball or Column
d = Diameter of Ball or Column
L = Standoff Height of Ball or Column
σ _max = Maximum Stress

The CGA Solution

Types of Columns

Wire Column

High-Lead wire attached with Sn63-Pb37 fillets

Reinforced Solder Column

High-Lead wire core with spiral wrapped copper ribbon attached with Sn63-Pb37 fillets

Straight Wire Column

Finite element model showing location of maximum strain (Left)
Typical failure of non-reinforced column (Right)

Benefits of the Reinforced Column

Copper Reinforced Column

Crack propagation abated
Redundancy without stiffness
Continues to function electrically even if core is cracked

Test Results

Temperature Cycles –10 to +125 C All parts ceramic with 1.27mm pitch 625 pin package 32mm square

CBGA625 | BGA with high-Pb spheres
CCGA625 | CGA with straight wire columns
CCGA625R | CGA with reinforced columns

Conclusion

Many commercial components are not capable of meeting the environmental requirements of military and space applications
CGA modifications to commercial devices result in
Reliability Improvements
Robust Designs
Reinforced solder columns show a significant performance advantage in comparison to other solder columns

Future Work

Military funding of this technology will allow significant improvements such as:
Optimize column design through finite element modeling and analysis of the reinforced column
Reliability testing and qualification of enhancements in design and materials
Development of a lead-free version

Acknowledgments

The author would like to thank Tom Clifford - Lockheed Martin and William Davis - Applied Material Technologies for their valuable analysis, discussions, and helpful input.

Bibliography

[1] D. Banks, D. Gerke, “Assembly and Reliability of Ceramic Column Grid Array

[2] A. Perkins, S. Sitaraman, “Thermo-mechanical Failure Comparison and Evaluation of CCGA and CBGA Packages

[3] T. Clifford, “Final Report – Phase 1 T-Cycle Test” Lockheed Martin Internal Document

[4] R. Winslow, “Converting Ball Grid Array Components to Column Grid Array” MASH 2005

sixsigmamicro

Six Sigma Microelectronics to Exhibit and Present at CMSE 2026

Visit Us at Booth B15

Technical Presentation

Presentation Title: “BGA Reballing for Mission-Critical Applications”

Let’s Connect at CMSE

DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma

Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages

SIX SIGMA Solder Column Technology used in CFEsat

Hot Solder Dip and Minimizing Thermal Gradients

Actel CCGA Board Level Testing Report

BGA Reballing for Military & Aerospace Applications

Introduction

The Problem

Reball Process Flow

Deball

Sphere Placement

Reflow

Process Monitors and Controls

Conclusion

The Reballing Solution

Contact Us

Converting Ball Grid Array to Column Grid Array

Introduction

The Problem

BGA vs. CGA

The CGA Solution

Types of Columns

Benefits of the Reinforced Column

Test Results

Conclusion

Future Work

Acknowledgments

Presentation Title:
“BGA Reballing for Mission-Critical Applications”